Ultra Fine Pitch Series (BPP:40-50μm)
ADR-H series - Bonding Pad Pitch: 50μm
| Part NO. | WD Wire Diameter |
H Hole diameter |
T Tip diameter |
CD Chamfer diameter |
OR Outer Radius |
α Face Angle |
θ Cone Angle |
β Inner Chamfer Angle |
|---|---|---|---|---|---|---|---|---|
| ADR-H-1 | 18/0.7 | 23/0.9 | 64/2.5 | 28/1.1 | 10/0.4 | 11° | 30° | 90° |
| ADR-H-2 | 20/0.8 | 25/1.0 | 64/2.5 | 30/1.2 | 10/0.4 | 11° | 30° | 90° |
| ADR-H-3 | 23/0.9 | 28/1.1 | 64/2.5 | 33/1.3 | 10/0.4 | 11° | 30° | 90° |
(μm/mil)
ADR-I series - Bonding Pad Pitch: 45μm
| Part NO. | WD Wire Diameter |
H Hole diameter |
T Tip diameter |
CD Chamfer diameter |
OR Outer Radius |
α Face Angle |
θ Cone Angle |
β Inner Chamfer Angle |
|---|---|---|---|---|---|---|---|---|
| ADR-I-1 | 18/0.7 | 23/0.9 | 56/2.2 | 28/1.1 | 8/0.3 | 11° | 30° | 90° |
| ADR-I-2 | 20/0.8 | 25/1.0 | 56/2.2 | 30/1.2 | 8/0.3 | 11° | 30° | 90° |
(μm/mil)
ADR-I series - Bonding Pad Pitch: 45μm
| Part NO. | WD Wire Diameter |
H Hole diameter |
T Tip diameter |
CD Chamfer diameter |
OR Outer Radius |
α Face Angle |
θ Cone Angle |
β Inner Chamfer Angle |
|---|---|---|---|---|---|---|---|---|
| ADR-J-1 | 15/0.6 | 18/0.7 | 51/2.0 | 25/1.0 | 8/0.3 | 11° | 30° | 90° |
| ADR-J-2 | 18/0.7 | 23/0.9 | 51/2.0 | 28/1.1 | 8/0.3 | 11° | 30° | 90° |
(μm/mil)
