Notice of Corporate Name Change - 

Adamant Namiki Precision Jewel Co., Ltd. will change its name on Jan. 1, 2023.

A special website is available.

Ceramic Capillary

Ultra Fine Pitch Series (BPP:40-50μm)

ADR-H series - Bonding Pad Pitch: 50μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-H-1 18/0.7 23/0.9 64/2.5 28/1.1 10/0.4 11° 30° 90°
ADR-H-2 20/0.8 25/1.0 64/2.5 30/1.2 10/0.4 11° 30° 90°
ADR-H-3 23/0.9 28/1.1 64/2.5 33/1.3 10/0.4 11° 30° 90°

(μm/mil)

ADR-I series - Bonding Pad Pitch: 45μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-I-1 18/0.7 23/0.9 56/2.2 28/1.1 8/0.3 11° 30° 90°
ADR-I-2 20/0.8 25/1.0 56/2.2 30/1.2 8/0.3 11° 30° 90°

(μm/mil)

ADR-I series - Bonding Pad Pitch: 45μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-J-1 15/0.6 18/0.7 51/2.0 25/1.0 8/0.3 11° 30° 90°
ADR-J-2 18/0.7 23/0.9 51/2.0 28/1.1 8/0.3 11° 30° 90°

(μm/mil)

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