Adamant Namiki

Optical Mounting Technology

Die Bonding / Wire Bonding

  • Mounting process for Optical chip, Electronic component, MEMS chip.
  • Die bonding by Ag paste, UV adhesive, solder etc…
Auto die bonder

Auto die bonder

Auto wire bonder

Auto wire bonder

EX) Wire bonding for MEMS chip

EX) Wire bonding for MEMS chip

Hermetic Seal (Packaging)

  • Hermetic sealing by N2 gus.
  • He leak test / Gross leak test equipment
  • Vacuum baking (~200°C)
Projection welding machine

Projection welding machine

EX) Packaging products (Window Glass)

EX) Packaging products (Window Glass)

Seam welding machine

Seam welding machine

Contact

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Mon-Fri 9:00-17:00 JST+81-3-3919-1171

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Online Contact