Capillary

High precision capillary produced withby HIP processing and polishing technology
Suitable for automotive applications
ヒップドセラミックス キャピラリ 高合金化率・優れた内径鏡面研磨・1µmの精度が特長です。 ヒップドセラミックス キャピラリ 高合金化率・優れた内径鏡面研磨・1µmの精度が特長です。

Capillaries are consumable tools used in bonding equipment (wire bonders). They are precision machined parts designed and manufactured based on the product to be bonded. We use high quality materials and can design and manufacture according to bonding specifications.
Our ceramic capillaries are HIP processed, which reduces the individual differences that affect quality, and are trusted by customers for automotive use that requires high reliability. In addition, our ruby capillary uses single crystal ruby and is the only product of its kind in the world. Mirror polishing of the internal diameter prevents wires (gold, silver, copper, alloy) from clogging.
We also offer customs products that can be quickly delivered to customers.

Features

  • Removal of residual pores by HIP treatment; densification
  • Prevents disconnection by improving the intermetallic ratio
  • Superior mirror polishing of internal diameter enables a smooth bonding process
  • High precision custom made
High precision capillary produced with HIP processing and polishing technology Suitable for automotive applications

Ceramic Capillary

Further Information

Ceramic Capillary

Our Ceramic Capillaries are manufactured by our Injection Molding Technology which is the same technology used in the mass production of our ferrules and sleeves used for the Optical Communication Industry. An excellent concentricity property has been achieved, which reduces the hours of operation significantly at the time of replacement due to the elimination of an alignment process. A longer capillary life span and a higher wear resistance has been achieved by using Zirconia Toughened Alumina Ceramic with a stronger hardness than the standard Alumina Ceramic. We can also accommodate a DLC (Diamond Like Carbon) Coating for an extended life span.

The function of Ceramic Capillaries is to allow a thin and brittle gold wire through at very high speeds. The Capillary shapes are required to be smooth and accurate for any bonding process. We polish the capillaries with high precision processing technology cultivated by the manufacturing of our Zirconia Ferrules and Sleeves.

Further Information

Ceramic Capillary

Material Characteristics

Longer capillary life span, adopting zirconia toughened alumina ceramic

Longer capillary life span and higher wear resistance have been achieved by zirconia toughened alumina ceramic with stronger hardness than the standard 99.99% aluminaceramic, and our unique process to increase hardness.

  Zirconia toughened Alumina 99.99% Alumina
Bending Strength 1,700 (N/mm2) 820 (N/mm2)
Hardness Vickers 1,900 (HV) 2,000 (HV)
Density 4.3 (g/cm2) 3.98 (g/cm2)
Average Grain Size ≤0.5μm ≤1.2μm
Color Appearance White White
Zirconia toughened Alumina
Bending strengh
1,700 (N/mm2)
Hardness vickers
1,900 (HV)
Density
4.3 (g/cm2)
Average grain size
≤0.5μm
Color appearance
White
99.9% Alumina
Bending strengh
820 (N/mm2)
Hardness vickers
2,000 (HV)
Density
3.98 (g/cm2)
Average grain size
≤1.2μm
Color appearance
White

Our strict quality control from the raw materials to the finished products allows cost reduction and competitiveness.

HIP Processing Additional HIP Treatment (Hot Isostatic Pressing)

In the HIP process, air bubbles generated between material particles are removed by applying high temperature (1000 ° C or more) and isotropic high pressure (1000 atm or more) to the object to be treated. (For reference, pressure at a sea depth of 6000 m is 600 atm.)


As a result, capillaries are densified and homogenized, and individual differences are reduced, and during bonding, the mashed ball diameter, shear strength, and intermetallic ratio are improved.

Capillary Shape

Reduce the damage to gold wire, the rare of contamination accumulation and wire breaking, achieved by the untapered straight hole with amooth and homogenerous surface.
And smooth geometry from chamfer to hole assures the stable bonding process.

Converentional capillaries sometimes have the tapered hole or rough surface, which causes the damage to the ball, the contamination accumilation and the wire breaking. Gentle transmutation from hole to tip through chamfer made by fine polishing reduces the damage to the wire and enable the stable bonding process.

Capillary abbreviation list

Create the ideal ball shape


Increase capillary durability by polishing the peripheral area of bottle neck with our unique and high precision process technology.

Concentricity

Excellent hole concentricity enables easy replacement procedure

With our unique precision process technology cultivated by the production of ferrule for optical communication, the excellent concentricity property has been achieved, which reduces the hours of operation significantly at the time of replacement due to the elimination of alighnment process.


Bonding Characteristics

Superior bonding characteristics are derived from the smooth and stable ball shape

Bonded ball size

Bonded ball size is affected by Wire Diameter (WD), Hole (H) and Chamfer Diameter (CD). The uniform and stable ball shape is possible with the accuracy of the smooth chamfer geometry and the excellent hole concentricity.


Ball shear ratio

This parameter is affected by WD, CD, pad substrate, mashed ball diameter and ball contact area. The satisfactory level of force and strength is committed by the stable geometry of chamfer.


Stitch bond

Important parameters affecting stitch bond are Tip diameter (T), Outer Radius (OR) and Face Angle (FA). Sufficient stitch bond on normal WD is achieved by the stable tip geometry, the tighter hole concentricity to T and the gentle OR.


Standard Type (BPP:140-150µm)

AZR-A series - Bonding Pad Pitch: 150μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-A-1 38/1.5 51/2.0 229/9.0 102/4.0 38/1.5 30° 120°
AZR-A-2 38/1.5 51/2.0 152/6.0 66/2.6 10/0.4 30° 90°
AZR-A-3 38/1.5 51/2.0 229/9.0 86/3.4 102/4.0 30° 90°
AZR-A-4 38/1.5 51/2.0 203/8.0 86/3.4 61/2.4 30° 90°
AZR-A-5 38/1.5 56/2.2 239/9.4 102/4.0 38/1.5 30° 120°
AZR-A-6 38/1.5 56/2.2 229/9.0 96/3.8 102/4.0 30° 90°
AZR-A-7 38/1.5 56/2.2 203/8.0 86/3.4 61/2.4 30° 90°
AZR-A-8 38/1.5 64/2.5 239/9.4 102/4.0 38/1.5 30° 120°
AZR-A-9 38/1.5 64/2.5 203/8.0 89/3.5 61/2.4 30° 90°
AZR-A-10 51/2.0 64/2.5 191/7.5 81/3.2 8/0.3 30° 90°
AZR-A-11 51/2.0 64/2.5 292/11.5 102/4.0 127/5.0 30° 90°
AZR-A-12 51/2.0 76/3.0 356/14.0 122/4.8 152/6.0 30° 90°
AZR-A-13 51/2.0 89/3.5 419/16.5 135/5.3 178/7.0 30° 90°
AZR-A-14 51.64/2.0, 2.5 76/3.0 330/13.0 140/5.5 64/2.5 30° 120°
AZR-A-15 64, 76/2.5, 3.0 89/3.5 330/13.0 127/5.0 64/2.5 30° 120°
AZR-A-16 64, 76/2.5, 3.0 102/4.0 330/13.0 140/5.5 64/2.5 30° 120°
AZR-A-17 76/3.0 102/4.0 483/19.0 168/6.6 203/8.0 30° 90°
(μm/mil)

AZR-B series - Bonding Pad Pitch: 140μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-B-1 22/0.9 33/1.3 140/5.5 64/2.5 20/0.8 30° 120°
AZR-B-2 25/1.0 38/1.5 165.6.5 74/2.9 25/1.0 30° 120°
AZR-B-3 25/1.0 38/1.5 89/3.5 53/2.1 8/0.3 30° 90°
AZR-B-4 25/1.0 38/1.5 114/4.5 53/2.1 8/0.3 30° 90°
AZR-B-5 25/1.0 38/1.5 178/7.0 64/2.5 76/3.0 30° 90°
AZR-B-6 25/1.0 38/1.5 203/8.0 53/2.1 89/3.5 30° 90°
AZR-B-7 25/1.0 43/1.7 165/6.5 74/2.9 25/1.0 30° 120°
AZR-B-8 25/1.0 43/1.7 203/8.0 53/2.1 89/3.5 30° 90°
AZR-B-9 25.30/1.0, 1.2 43/1.7 229/9.0 74/2.9 30/1.2 30° 120°
AZR-B-10 25.30/1.0, 1.2 43/1.7 152/6.0 59/2.3 8/0.3 30° 120°
AZR-B-11 25.30/1.0, 1.2 43/1.7 203/8.0 74/2.9 89/3.5 30° 90°
AZR-B-12 25.30/1.0, 1.2 46/1.8 229/9.0 74/2.9 38/1.5 30° 120°
AZR-B-13 30/1.2 46/1.8 203/8.0 76/3.0 89/3.5 30° 90°
(μm/mil)

Fine Pitch Series (BPP:60-100µm)

AZR-C series - Bonding Pad Pitch: 100μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-C-1 25/1.0 38/1.5 130/5.1 53/2.1 30/1.2 11° 30° 90°
AZR-C-2 30/1.2 38/1.5 130/5.1 56/2.2 30/1.2 11° 30° 90°
AZR-C-3 30/1.2 38/1.5 130/5.1 56/2.2 30/1.2 30° 90°
AZR-C-4 30/1.2 38/1.5 130/5.1 56/2.2 30/1.2 30° 90°
AZR-C-5 30/1.2 41/1.6 130/5.1 59/2.3 30/1.2 11° 30° 90°
(μm/mil)

AZR-D series - Bonding Pad Pitch: 90μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-D-1 25/1.0 33/1.3 109/4.3 51/2.0 13/0.5 11° 30° 90°
AZR-D-2 25/1.0 33/1.3 109/4.3 51/2.0 13/0.5 30° 90°
AZR-D-3 25/1.0 33/1.3 109/4.3 51/2.0 13/0.5 30° 90°
AZR-D-4 25/1.0 35/1.4 109/4.3 51/2.0 20/0.8 11° 30° 90°
AZR-D-5 30/1.2 38/1.5 109/4.3 51/2.0 20/0.8 11° 30° 90°
AZR-D-6 30/1.2 38/1.5 109/4.3 53/2.1 13/0.5 30° 90°
AZR-D-7 30/1.2 38/1.5 109/4.3 53/2.1 13/0.5 30° 90°
(μm/mil)

AZR-E series - Bonding Pad Pitch: 80μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-E-1 25/1.0 33/1.3 99/3.9 48/1.9 13/0.5 30° 90°
AZR-E-2 25/1.0 33/1.3 99/3.9 48/1.9 13/0.5 30° 90°
AZR-E-3 25/1.0 33/1.3 99/3.9 48/1.9 13/0.5 11° 30° 90°
AZR-E-4 25/1.0 35/1.4 99/3.9 46/1.8 13/0.5 11° 30° 90°
AZR-E-5 30/1.2 38/1.5 99/3.9 51/2.0 13/0.5 30° 90°
AZR-E-6 30/1.2 38/1.5 99/3.9 51/2.0 13/0.5 30° 90°
(μm/mil)

AZR-F series - Bonding Pad Pitch: 70μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-F-1 25/1.0 30/1.2 91/3.6 43/1.7 10/0.4 30° 90°
AZR-F-2 25/1.0 30/1.2 91/3.6 43/1.7 10/0.4 30° 90°
AZR-F-3 25/1.0 33/1.3 91/3.6 43/1.7 13/0.5 11° 30° 90°
(μm/mil)

AZR-G series - Bonding Pad Pitch: 60μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-G-1 23/0.9 28/1.1 81/3.2 35/1.4 13/0.5 11° 30° 90°
AZR-G-2 25/1.0 30/1.2 81/3.2 35/1.4 13/0.5 11° 30° 90°
(μm/mil)

Ultra Fine Pitch Series (BPP:40-50µm)

AZR-H series - Bonding Pad Pitch: 50μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-H-1 18/0.7 23/0.9 64/2.5 28/1.1 10/0.4 11° 30° 90°
AZR-H-2 20/0.8 25/1.0 64/2.5 30/1.2 10/0.4 11° 30° 90°
AZR-H-3 23/0.9 28/1.1 64/2.5 33/1.3 10/0.4 11° 30° 90°
(μm/mil)

AZR-I series - Bonding Pad Pitch: 45μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-I-1 18/0.7 23/0.9 56/2.2 28/1.1 8/0.3 11° 30° 90°
AZR-I-2 20/0.8 25/1.0 56/2.2 30/1.2 8/0.3 11° 30° 90°
(μm/mil)

AZR-J series - Bonding Pad Pitch: 40μm

Part NO. WD
Wire Diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
AZR-J-1 15/0.6 18/0.7 51/2.0 25/1.0 8/0.3 11° 30° 90°
AZR-J-2 18/0.7 23/0.9 51/2.0 28/1.1 8/0.3 11° 30° 90°
(μm/mil)

Special matte processing for ceramic capillary

Special mat processing is processing to roughen the surface of the specified part.
By roughening the surface, aspects such as wettability of the adhesive and plating strength can be improved.
In the ceramic capillary, the strength of 2nd bonding can also be improved by improving the grip force.
Considering compatibility with the bonded material, there are 4 types of mat construction methods.

1) Physical roughening
2) Blast treatment
3) Chemical treatment
4) Our proprietary processing method

Case study

Side-cut capillary

As devices become smaller and with higher density, narrow packages are increasing.

We propose a side cut capillary for narrow bond pitch with high bonding strength in order not to touch nearby wires and obstacles.


We supply the only single crystal ruby capillary in the world
Ruby Capillary

Further Information

Ruby Capillary

Ruby Capillaries can maintain their form because of the high hardness of the material after a Wire Bonding Application. Our Ruby Capillaries can be used repeatedly because of our Gold Wire Washing Coat Process which is attached to the Ruby Capillary Surface.

The function of Ruby Capillaries is to allow a thin and brittle gold wire through at very high speeds. The Capillary shapes are required to be smooth and accurate for any bonding process. We manufacture the capillary hole diameter with a high precision processing technology by using a Laser Irradiation Process and a polishing process by using a diamond powder.

Further Information

Ruby Capillary

Material Characteristics

Excellent smoothness of single crystal ruby capillary prevents the damage and contamination accumulation of gold wire.

Our ruby capillary is made from single crystal ruby. Since the surface smoothness is superior to standard 99.99% alumina ceramic capillary, the damage of gold wire is reduced. In addition, the hardness is suitable to bottleneck form.

  Single crystal ruby 99.9% Alumina
Bending strengh 1,026 (N/mm2) 820 (N/mm2)
Hardness vickers 2,000 (HV) 2,000 (HV)
Density 3.99 (g/cm2) 3.98 (g/cm2)
Average grain size Single crystal ≤1.2μm
Color appearance Red White
Single crystal ruby
Bending strengh
1,026 (N/mm2)
Hardness vickers
2,000 (HV)
Density
3.99 (g/cm2)
Average grain size
Single crystal
Color appearance
Red
99.9% Alumina
Bending strengh
820 (N/mm2)
Hardness vickers
2,000 (HV)
Density
3.98 (g/cm2)
Average grain size
≤1.2μm
Color appearance
White

 

Our strict quality and production control from the raw materials to the finished products allows cost reduction and competitiveness.

Rework and Cleaning for Reuse

By adoption of single crystal ruby which is excellent in chemical resistance, repetition of rework and cleaning for reuse of the capillary become possible. Ruby capillary is thus envernmental-friendly product.

Cleaning for reuse

At the cleaning process, aqua regina and alkali remove adhesion of gold and carbide, respectively. Chemical residue doesn't adhere to the single crystal ruby capillary, so damage of gold wire can be eliminated. Because the capillary seldom has got bruises, it can be repeatedly used only by cleaning.
We clean and inspect the capillary responsibly, so the quality is promised ans good as new products.


Rework

Rejected capillary can be re-new as reworked capillary with re-polish and re-processing onto the capillary tip. Reworking (re-processing at the tip) of capillary can be repeated until it becomes unfitted form for wire bonding. By using reworked capillary, the cost and environmental load can be reduced.


Life Cycle of Ruby Capillary

* When you send the capillary, please specify the cleanming course or the reworking course.
Narrow pitch. Adaptation to the low-temperature bonding. DLC (Diamond Like Carbon) coating achieve excellent wear resistance and threefold longer life span.

Recently, higher wear resistance is required for capillary at the adaptation to narrow pitch and low temperature bonding process.
DLC coated single crystal ruby capillary developed by our company ahead of other companies achieves 3 times the abrasion resistance compared to the case without coating. Reduction od capillary change frequency provide benefits such as reduction of maintenance time, increasing controllable machine number, improvement in productivity, and contributes to increase your profits.

DLC Coating

Since wear resistance increased three times, usage of capillary also increased threefold. Stable CD form of capillary enables improvement in bonding ability.

Since DLC coated ruby capillary has low coefficient of friction surface, the dirt rarely adheres to the capillary's tip. This coating achieves longer life span of capillary.

At the bonding process, the dirt which adheres to the capillary's tip is one of the factors to reduce the capillary life span. Since coefficient of friction is decreased by the DLC coating, adhesion of durt on the capillary tip is reduced.

Standard Type  (BPP: ≤100µm)

ADR-A series - Bonding Pad Pitch: 140μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-A-1 38/1.5 51/2.0 229/9.0 102/4.0 38/1.5 30° 120°
ADR-A-2 38/1.5 51/2.0 152/6.0 67/2.6 10/0.4 30° 90°
ADR-A-3 38/1.5 51/2.0 229/9.0 86/3.4 102/4.0 30° 90°
ADR-A-4 38/1.5 51/2.0 203/8.0 86/3.4 61/2.4 30° 90°
ADR-A-5 38/1.5 56/2.2 239/9.4 102/4.0 38/1.5 30° 120°
ADR-A-6 38/1.5 56/2.2 229/9.0 96/3.8 102/4.0 30° 90°
ADR-A-7 38/1.5 56/2.2 203/8.0 86/3.4 61/2.4 30° 90°
ADR-A-8 38/1.5 64/2.5 239/9.4 102/4.0 38/1.5 30° 120°
ADR-A-9 38/1.5 64/2.5 203/8.0 89/3.5 61/2.4 30° 90°
ADR-A-10 51/2.0 64/2.5 191/7.5 81/3.2 8/0.3 30° 90°
ADR-A-11 51/2.0 64/2.5 292/11.5 102/4.0 127/5.0 30° 90°
ADR-A-12 51/2.0 76/3.0 356/14.0 122/4.8 152/6.0 30° 90°
ADR-A-13 51/2.0 89/3.5 419/16.5 135/5.3 178/7.0 30° 90°
ADR-A-14 51.64/2.0, 3.0 76/3.0 330/13.0 140/5.5 64/2.5 30° 120°
ADR-A-15 64, 76/2.5, 3.0 89/3.5 330/13.0 127/5.0 64/2.5 30° 120°
ADR-A-16 64, 76/2.5, 3.0 102/4.0 330/13.0 140/5.5 64/2.5 30° 120°
ADR-A-17 76/3.0 102/4.0 483/19.0 168/6.6 203/8.0 30° 90°
(μm/mil)

ADR-B series - Bonding Pad Pitch: ≤100μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-B-1 22/0.9 33/1.3 140/5.5 60/2.3 20/0.8 30° 120°
ADR-B-2 25/1.0 38/1.5 165.6.5 74/2.9 25/1.0 30° 120°
ADR-B-3 25/1.0 38/1.5 89/3.5 53/2.1 8/0.3 30° 90°
ADR-B-4 25/1.0 38/1.5 114/4.5 53/2.1 8/0.3 30° 90°
ADR-B-5 25/1.0 38/1.5 178/7.0 64/2.5 76/3.0 30° 90°
ADR-B-6 25/1.0 38/1.5 203/8.0 53/2.1 89/3.5 30° 90°
ADR-B-7 25/1.0 43/1.7 165/6.5 74/2.9 25/1.0 30° 120°
ADR-B-8 25/1.0 43/1.7 203/8.0 53/2.1 89/3.5 30° 90°
ADR-B-9 25.30/1.0, 1.2 43/1.7 229/9.0 74/2.9 30/1.2 30° 120°
ADR-B-10 25.30/1.0, 1.2 43/1.7 152/6.0 59/2.3 8/0.3 30° 120°
ADR-B-11 25.30/1.0, 1.2 43/1.7 203/8.0 74/2.9 89/3.5 30° 90°
ADR-B-12 25.30/1.0, 1.2 46/1.8 229/9.0 74/2.9 38/1.5 30° 120°
ADR-B-13 30/1.2 46/1.8 203/8.0 76/3.0 89/3.5 30° 90°
(μm/mil)

Fine Pitch Series (BPP:60-100µm)

ADR-C series - Bonding Pad Pitch: ≤100μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-C-1 25/1.0 38/1.5 130/5.1 53/2.1 30/1.2 11° 30° 90°
ADR-C-2 30/1.2 38/1.5 130/5.1 56/2.2 30/1.2 11° 30° 90°
ADR-C-3 30/1.2 38/1.5 130/5.1 56/2.2 30/1.2 30° 90°
ADR-C-4 30/1.2 38/1.5 200/7.9 74/2.9 51/2.0 30° 90°
ADR-C-5 30/1.2 41/1.6 130/5.1 59/2.3 30/1.2 11° 30° 90°
(μm/mil)

ADR-D series - Bonding Pad Pitch: 90μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-D-1 25/1.0 33/1.3 109/4.3 51/2.0 13/0.5 11° 30° 90°
ADR-D-2 25/1.0 33/1.3 109/4.3 51/2.0 13/0.5 30° 90°
ADR-D-3 25/1.0 33/1.3 109/4.3 51/2.0 13/0.5 30° 90°
ADR-D-4 25/1.0 35/1.4 109/4.3 51/2.0 20/0.8 11° 30° 90°
ADR-D-5 30/1.2 38/1.5 109/4.3 51/2.0 20/0.8 11° 30° 90°
ADR-D-6 30/1.2 38/1.5 109/4.3 53/2.1 13/0.5 30° 90°
ADR-D-7 30/1.2 38/1.5 109/4.3 53/2.1 13/0.5 30° 90°
(μm/mil)

ADR-E series - Bonding Pad Pitch: 80μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-E-1 25/1.0 33/1.3 99/3.9 48/1.9 13/0.5 30° 90°
ADR-E-2 25/1.0 33/1.3 99/3.9 48/1.9 13/0.5 30° 90°
ADR-E-3 25/1.0 33/1.3 99/3.9 48/1.9 13/0.5 11° 30° 90°
ADR-E-4 25/1.0 35/1.4 99/3.9 46/1.8 13/0.5 11° 30° 90°
ADR-E-5 30/1.2 38/1.5 99/3.9 51/2.0 13/0.5 30° 90°
ADR-E-6 30/1.2 38/1.5 99/3.9 51/2.0 13/0.5 30° 90°
(μm/mil)

ADR-F series - Bonding Pad Pitch: 70μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-F-1 25/1.0 30/1.2 91/3.6 43/1.7 10/0.4 30° 90°
ADR-F-2 25/1.0 30/1.2 91/3.6 43/1.7 13/0.5 30° 90°
ADR-F-3 25/1.0 33/1.3 99/3.9 48/1.9 13/0.5 11° 30° 90°
(μm/mil)

ADR-G series - Bonding Pad Pitch: 60μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-G-1 23/0.9 28/1.1 81/3.2 35/1.4 13/0.5 11° 30° 90°
ADR-G-2 25/1.0 30/1.2 81/3.2 35/1.4 13/0.5 11° 30° 90°
BPP: 60μm(μm/mil)

Ultra Fine Pitch Series  (BPP:40-50µm)

ADR-H series - Bonding Pad Pitch: 50μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-H-1 18/0.7 23/0.9 64/2.5 28/1.1 10/0.4 11° 30° 90°
ADR-H-2 20/0.8 25/1.0 64/2.5 30/1.2 10/0.4 11° 30° 90°
ADR-H-3 23/0.9 28/1.1 64/2.5 33/1.3 10/0.4 11° 30° 90°
(μm/mil)

ADR-I series - Bonding Pad Pitch: 45μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-I-1 18/0.7 23/0.9 56/2.2 28/1.1 8/0.3 11° 30° 90°
ADR-I-2 20/0.8 25/1.0 56/2.2 30/1.2 8/0.3 11° 30° 90°
(μm/mil)

ADR-J series - Bonding Pad Pitch: 40μm

Part NO. WD
Wire diameter
H
Hole diameter
T
Tip diameter
CD
Chamfer diameter
OR
Outer Radius
α
Face Angle
θ
Cone Angle
β
Inner Chamfer Angle
ADR-J-1 15/0.6 18/0.7 51/2.0 25/1.0 8/0.3 11° 30° 90°
ADR-J-2 18/0.7 23/0.9 51/2.0 28/1.1 8/0.3 11° 30° 90°
(μm/mil)

Custom-made

Please fill the blank space of custom-made order sheet.
Custom-made Order Sheet


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