We provide standard precision processing of holes, cylinders, and grooves, with micron-level accuracy. The outstanding processing accuracy has been achieved through the application of technology cultivated in laser processing and hard materials polishing technology used in cutting diamond and making phonograph needles. In addition to the crystal growth, our know-how enables us to process the crystal while measuring plane direction through X-rays so that high processing accuracy is possible (accuracy of dimension). High precisione processing according to customer's specified plane direction is possible on diamond, sapphire and ruby.
Precision processing of holes
Although, at first glance, a zirconia ferrule looks like just a simple ceramic cylinder, our cylindrical processing technology is indispensable for machining and it is a very complex processing technology.
The outer diameter is ground and polished on a submicron level, and it can meet a tolerance of ±0.0005mm.
Drilling a cylindrical hole, or enlarging a drilled hole.
We can perform high precision processing with our own internal machines and special tools.
Inner diameter processing
The difficulty in bore processing is that, for example, when the work material is a hard material such as ceramic, it can not be easily processed with a tool such as a blade, so the cylindricity and the surface roughness of the inner diameter become uneven.
We have been pursuing manufacturing using our know-how to get nanometer level accuracy while still maintaining roundness and staying true to the characteristic nature of the material.
Although the typical application differs for each product, as an example, one product with one or more φ0.1 to φ1.2 mm through holes in the center can be used in parts such as liquid injection nozzles (for pesticide spraying, etc.).
With our processing technology, it is possible to machine a φ0.01 mm hole in various ceramic materials.
Oval hole processing
Elliptical hole is machined by applying laser processing and grooving processing.
Oval-shaped via hole with a width of 0.02mm x length of about 0.1mm.
Material: Tungsten carbide
In addition to cemented carbide, our company also specializes processing fine ceramics such as alumina, zirconia, and single crystal ruby.
In cases where processing is difficult with conventional methods, grinding and polishing is sometimes done with diamond abrasive grains or by ultrasonic or electrical discharge machining. However, these methods can not maintain the inherent physical properties of ceramics, so challenges arise where the required precision can not be met or processing time is too long.
At our company, we’ve developed a technology that can process fine ceramics by combining our personal technology with a high power focused laser and a special optical system.
In drilling processing, we have established high precision micro perforation technology that can machine materials such as ceramics, alumina ceramics, silicon nitride and aluminum nitride.
As an example, when drilling a φ 0.05mm hole in a material with t = 0.5 mm, a straight via hole is achieved with a high precision aspect ratio (ratio of hole diameter to plate thickness) of 10 and hole tolerance ± 2μm.
Additionally, there are no debris around the hole, the machined surface is smooth, and secondary machining is not required.
Processing to taper diamond, titanium, etc. can accommodate taper angles from 15 degrees to 120 degrees.
Small hole drilling using electrical discharge machining (EDM)
Capable of drilling holes φ0.1 mm to φ 0.9 mm in carbide as well as conductive materials.
Wire electrical discharge machining
Suitable for tapering or four-sided processing of conductive material such as cemented carbide.
Wire diameter: φ0.05～φ0.2
Minimum width 0.03 mm / Depth 0.23 mm.
It can be done by in-house manufacturing machine.
Grinding of various metals and ceramics
- Our company's polishing process is characterized by a super-polished finishing, and can achieve high surface accuracy for inner/outer diameter processing of hard materials.
- Surface roughness Ra 0.01 or less
Messured by KEYENCE laser microscope
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